Equipment Lineup
Assembly
B001167
Wire bonder: UTC-5000
*Click to enlarge
Main specs
| Manufacturer | Shinkawa |
|---|---|
| Model | UTC-5000 |
| Control number | 1167 |
| Location | YACDastech satellite |
| Price | Please Contact Us |
Detailed Information
[UTC-5000 Features]
- 10% faster bonding speed than previous models
- Supports frame widths up to 95mm x 300mm
- Supports maximum wire diameters up to 50μm
- Maximum bond load: 3x higher than previous models
- Minimum capacitance for AC non-bond detection: 1/3 of previous models
- 10% faster bonding speed than previous models
- Supports frame widths up to 95mm x 300mm
- Supports maximum wire diameters up to 50μm
- Maximum bond load: 3x higher than previous models
- Minimum capacitance for AC non-bond detection: 1/3 of previous models
