This machine is for laminating dry-resist film inside the circumference of a wafer as a part of the wafer resisting process.
Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
Dry-resist film saves resist solution drastically in the conventional wet resist process.
Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.

Wafer Size: 5 inch, 6 inch, 8 inch
Film Width: 5 inch: 150-160mm / 6 inch: 180-200mm / 8 inch: 225-230mm